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Home/ Products & Services/Bioindustrial/Adhesives and Sealants/Adhesives and Sealants Applications/Electronics
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Electronics

In displays and flexible electronics, polymer modification of materials with our specialized bio-based* building blocks enables flexibility, even in low temperature environments as well as low color and high UV resistance for ultra-transparent materials. These products also provide improved adhesion for over-molding, printing, and lamination.

Potting compounds & interconnects

Similar to films and substrates, our bio-based building blocks such as low dielectric polyols and amines are used to deliver an improved carbon footprint, while increasing the durability and lifetime of electronic devices. These products help with better impact strength, improved flow properties and lasting flexibility. These products also can help with enhanced protection against moisture, excellent low temperature performance, and superior resistance to heat and oxidation.

Know more about our product range benefits per application:

Priplast™ polyol, Pripol™ dimer acid, and Pripol™ dimer diol are polyols used in Polyurethanes for potting/encapsulation and conformal coatings. This products have lower crystallinity and slower crystallization to reduce shrinkage, and provide improved flexibility, toughness, and excellent water repellent and durability.

These products also have good adhesion to multiple substrates with hydrolytic and thermo-oxidative stability. They also feature low color and low metal content.

For Priamine™ dimer diamine, this product is for epoxy potting compounds or bonding adhesives for surface-mount components. This product also is good for polyamide hotmelts.

Finally, B-Tough™, a reactive toughening agent helps with improved impact resistances in epoxy structural adhesives. This product also provides substrate protection from moisture diffusion, and improved adhesion after humid aging.

*ASTM D6866

Contact us  Download adhesives brochure  Download polymer modification brochure

Priplast - Electronics Circuit Board - 700x467

Priplast™ 1838 additive offers enhanced durability in polyurethane systems through superior chemical, oxidative and UV resistance.

This versatile, all-round polyester polyol (MW 2000) brings overall high performance to adhesives, coatings and elastomers, providing exceptional hydrophobicity and excellent color.

Priplast™ 1838 is an ISCC PLUS certified product. The vegetable oil bio-based content comes from sustainable ISCC certified sources (mass balance), supporting the sourcing of vegetable oil products.

Discover more

 

Quality additives for electronic products

 

Electronic circuit board

B-Tough™ A2 

Our epoxy functional toughening technology brings impact strength to structural resins and adhesives without impacting the hardness of the matrix.

These products enhance durability by absorbing microcracks caused by ageing and thermal shock. B-Tough™ A2 is a reactive toughening ingredient that brings excellent stability and is recommended for use in liquid and/or solid type epoxy resins (medium polarity grade).

Learn more

Three mobile phones including one with a flexible screen

Priamine™ 1075

Priamine™ 1075 is a low viscosity, high purity dimer diamine building block is designed for use in high molecular weight polyamides and high-performance polyimides in adhesives, sealants, elastomers and engineering plastics.

It gives formulators freedom to adjust the melting point, allowing for higher temperature exposure of the end product without compromise on performance. Priamine™ 1075 dimer diamine is an ISCC PLUS certified product.

The vegetable oil bio-based content comes from sustainable ISCC certified sources (mass balance), supporting the sourcing of vegetable oil.

Learn more

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